* 6 CANS PROLOK 25.57 OZ * 1 CAN PRO-KLEAN, 1 FGUN2 *NONRETURNABLE/NONREFUNDABLE

Part Number:
PLOKJK
OEM Number:
PLOKJK
Price:
$109.00/EA
Call For Availability In Stock

PRO-LOK™ FOAM TO FOAM ADHESIVE JUNIOR KIT

ProLok™ Professional High-Bonding Spray Foam

Demand's Original Pro-Lok™ spray foam is a low expanding, high bonding adhesive. An excellent resource for any on-site construction adhesion needs. Works great with EIFS, ICF and SIPs, architectural foam shapes, as well as stone work, gypsum board, brick and cement boards. Unmatched elasticity and flexibility as the form expands and compresses. Seals cracks and fills in gaps. 

 

PRODUCT FEATURES

  • Low expansion 
  • High bonding polyurethane strength
  • ONE-STEP adhesive (once initial contact is made, there is NO need to pull apart)
  • B2 Fire rated economically insulates, fills, seals and bonds 
  • Easy to use 
  • High insulating value-saves energy and money
  • 18 month shelf life

* Pro-Lok is prohibited on all domestic and international AIR shipments.

 

 
Includes:

    6 Cans of 25.57 oz., Pro-Lok

    1 Pro Dispensing Gun, FGUN2

    1 Can of 13.4 oz., Pro-Klean


Technical Data

 

Basic Component

Polyurethane 

Type

Gun type

Tack-Free Time(min)

20

Cutting Time(min)

60(+25℃)

Density(kg/3)

25-35

Adhesion to EPS(N/mm2)

0,033

Adhesion to XPS(N/mm2)

0,039

Thermal conductivity (W/m2K)

0,034

Adhesive strength(kPa)

11,2

Tensile strength(N/cm2)

12

Compressive strength(kPa)

>150

Fire Class of the cured foam

B2

Environment

Contains no CFC’s, 

no HCFC’s, 

Ozone  friendly

Toxicity of cured foam

Non-toxicity

Cured foam temperature endurance()

-40~+120

Processing temperature()

+5℃ to +35℃

Output (m² of wall surface)

12

Shelf life(month)

18

 

EPS – Expanded Polystyrene
XPS – Extruded Polystyrene
The values specified were obtained at +23 °C and 50% relative humidity, unless otherwise specified.


Application conditions:
Usage temperature between +5℃~+35℃, best result at 20℃. The cured foan temperature endurance -40℃~+120℃
Non suitable for structural bonding